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ICS830 B18T1 25SC6R8M 160AT LD111 A2S1CSQ 1N6147A 20080
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  1 infrared light emitting diodes 2.3 1.9 4.5 0.3 2.54 1.2 4.2 0.3 ?.5 0.2 4.8 0.3 2.4 2.4 2.8 12.5 min. 10.0 min. 1.8 1.0 0.45 0.15 2-0.45 0.15 2-0.98 0.2 r1.75 not soldered 1: cathode 2: anode unit : mm 12 LN65 gaas infrared light emitting diode for optical control systems absolute maximum ratings (ta = 25?c) parameter symbol ratings unit power dissipation p d 160 mw forward current (dc) i f 100 ma pulse forward current i fp * 1.5 a reverse voltage (dc) v r 3v operating ambient temperature t opr C25 to +85 ?c storage temperature t stg C 40 to +100 ?c * f = 100 hz, duty cycle = 0.1 % features high-power output, high-efficiency : p o = 5.5 mw (typ.) good radiant power output linearity with respect to input current suited for use in high-speed modulation infrared light emission close to monochromatic light : l p = 950 nm (typ.) electro-optical characteristics (ta = 25?c) parameter symbol conditions min typ max unit radiant power p o i f = 100ma 4.3 5.5 mw peak emission wavelength l p i f = 100ma 950 nm spectral half band width dl i f = 100ma 50 nm forward voltage (dc) v f i f = 100ma 1.3 1.6 v reverse current (dc) i r v r = 3v 10 m a capacitance between pins c t v r = 0v, f = 1mhz 50 pf half-power angle q the angle in which radiant intencity is 50% 35 deg.
2 LN65 infrared light emitting diodes i f ?ta 120 100 80 60 40 20 ambient temperature ta (?c ) allowable forward current i f (ma) 0 20406080100 0 ?25 i fp ?duty cycle 10 2 10 1 10 ? 10 ? duty cycle (%) pulse forward current i fp (a) 10 ? 10 10 2 1 10 ? 10 ? ta = 25?c i f ?v f 120 100 80 40 20 60 0 forward voltage v f (v) ta = 25?c forward current i f (ma) 0 0.4 0.8 1.2 2.0 1.6 d p o ?i f 120 80 40 100 60 20 20 40 60 80 100 120 0 0 ta = 25?c forward current i f (ma) relative radiant power d p o i fp ?v f 10 4 10 3 10 2 10 1 forward voltage v f (v) pulse forward current i fp (ma) 10 ? 0 t w = 10 s duty cycle = 0.1% ta = 25?c 135 24 d p o ?ta 10 1 ambient temperature ta (?c ) relative radiant power d p o ?40 0 40 80 120 i f = 100ma 10 2 10 3 l p ?ta 1000 980 960 940 920 900 ambient temperature ta (?c ) i f = 100ma peak emission wavelength l p (nm) ?40 0 40 80 120 d p o ?i fp 10 3 10 2 10 1 pulse forward current i fp (ma) relative radiant power d p o 10 3 10 4 10 2 10 ? 10 ? 110 t w = 10 s (1) f = 100hz (2) f = 21khz (3) f = 42khz (4) f = 60khz ta = 25?c v f ?ta 1.6 1.2 0.8 0.4 0 ambient temperature ta (?c ) forward voltage v f (v) ?40 0 40 80 120 (1) (2) (3) (4) i f = 100ma 50ma
3 infrared light emitting diodes LN65 spectral characteristics 100 80 60 40 20 wavelength l (nm) relative radiant intensity (%) 900 940 980 1020 1060 1100 0 860 i f = 100ma ta = 25?c frequency characteristics 10 2 10 1 10 ? frequency f (khz) modulation output 10 3 10 4 10 2 10 ? 10 ta = 25?c 0? 10? 20? 30? 40? 50? 60? 70? 80? 90? directivity characteristics 20 90 100 80 70 60 50 40 30 relative radiant intensity(%)
caution for safety danger please read the following notes before using the datasheets a. these materials are intended as a reference to assist customers with the selection of panasonic semiconduc- tor products best suited to their applications. due to modification or other reasons, any information contained in this material, such as available product types, technical data, and so on, is subject to change without notice. customers are advised to contact our semiconductor sales office and obtain the latest information before starting precise technical research and/or purchasing activities. b. panasonic is endeavoring to continually improve the quality and reliability of these materials but there is always the possibility that further rectifications will be required in the future. therefore, panasonic will not assume any liability for any damages arising from any errors etc. that may appear in this material. c. these materials are solely intended for a customer's individual use. therefore, without the prior written approval of panasonic, any other use such as reproducing, selling, or distributing this material to a third party, via the internet or in any other way, is prohibited. request for your special attention and precautions in using the technical information and semiconductors described in this material (1) an export permit needs to be obtained from the competent authorities of the japanese government if any of the products or technologies described in this material and controlled under the "foreign exchange and foreign trade law" is to be exported or taken out of japan. (2) the technical information described in this material is limited to showing representative characteristics and applied circuit examples of the products. it does not constitute the warranting of industrial property, the granting of relative rights, or the granting of any license. (3) the products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household ap- pliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (4) the products and product specifications described in this material are subject to change without notice for reasons of modification and/or improvement. at the final stage of your design, purchasing, or use of the prod- ucts, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifi- cations satisfy your requirements. (5) when designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage and heat radiation characteristics. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, redundant design is recommended, so that such equipment may not violate relevant laws or regulations because of the function of our products. (6) when using products for which dry packing is required, observe the conditions (including shelf life and after- unpacking standby time) agreed upon when specification sheets are individually exchanged. (7) no part of this material may be reprinted or reproduced by any means without written permission from our company. gallium arsenide material (gaas) is used in this product. therefore, do not burn, destroy, cut, crush, or chemi- cally decompose the product, since gallium arsenide material in powder or vapor form is harmful to human health. observe the relevant laws and regulations when dispos- ing of the products. do not mix them with ordinary in- dustrial waste or household refuse when disposing of gaas-containing products. 2001 mar


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